Symbol, Footprint, 3D ModelSpecifications
- StatusActive
- TechnologyPlanar
- FamilyUltra Fast Recovery
- PackageThinDPAK
- MSL1
- AEC-QNo
- TJ Max. (°C)175
- trr (ns)25
- IF(AV) (A)4
- VRRM (V)200
- IFSM (A)130
- VF (V)0.92
- IR (µA)2
- RoHS CompliantYes with exemption 7(a)
- Halogen-Free StandardIEC 61249-2-21
- Solderability StandardJ-STD-002
- Terminal FinishMatte Tin
- Product Weight(g)0.192
- Flammability RatingUL 94 V-0
DataSheet
- DataSheet
Resources
Tools
Technical Library
- Spice Model
Reliability
- MTBF/ MTTF Report
- Reliability Report
- Whisker Report
Additional information
- Product Shelf Life
- Process Change Notification
- Material Composition Declaration
